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| STTH30L06 Turbo 2 ultrafast high voltage rectifier Main product characteristics IF(AV) VRRM Tj VF (typ) trr (max) 30 A 600 V 175C 1.0 V 65 ns K A A K TO-220AC STTH30L06D DO-247 STTH30L06W Features and benefits Ultrafast switching Low reverse current Low thermal resistance Reduces switching & conduction losses Package insulation voltage DOP3I: 2500 VRMS A A K A K D2PAK STTH30L06G DOP3I STTH30L06PI Description The STTH30L06, which is using ST Turbo 2 600V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PFC boost diode. Order codes Part Number STTH30L06D STTH30L06G STTH30L06G-TR STTH30L06W STTH30L06PI Marking STTH30L06D STTH30L06G STTH30L06G STTH30L06W STTH30L06PI August 2006 Rev 4 1/10 www.st.com 10 Characteristics STTH30L06 1 Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward voltage TO-220AC / TO-247 / D2 Average forward current DOP3I Surge non repetitive forward current Storage temperature range Maximum operating junction temperature PAK Tc = 125 C = 0.5 Tc = 95 C = 0.5 Value 600 50 30 160 -65 to + 175 175 Unit V A A A C C tp = 10 ms sinusoidal Table 2. Symbol Rth(j-c) Thermal resistance Parameter TO-220AC / TO-247 / D2PAK Junction to case DOP3I 1.7 Value (max). 1.1 C/W Unit Table 3. Symbol IR (1) VF (2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 150 C Forward voltage drop Tj = 25 C Tj = 150 C VR = VRRM Min. Typ Max. 25 A 80 800 1.55 IF = 30 A V 1.0 1.25 Unit 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.95 x IF(AV) + 0.010 IF2(RMS) Table 4. Symbol trr IRM tfr VFP Dynamic Characteristics Parameter Reverse recovery time Reverse recovery current Forward recovery time Forward recovery voltage Tj = 25 C Tj = 125 C Tj = 25 C Tj = 25 C Test conditions IF = 0.5 A Irr = 0.25 A IR =1 A IF = 1 A dIF/dt = 50 A/s VR =30 V VR = 400 V IF = 30 A dIF/dt = 100 A/s IF = 30 A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 30 A dIF/dt = 100 A/s VFR = 1.1 x VFmax 2.5 65 11.5 Min Typ Max 65 ns 90 16 500 A ns V Unit 2/10 STTH30L06 Characteristics Figure 1. P(W) 50 45 40 35 30 25 20 15 10 5 0 0 5 Conduction losses versus average Figure 2. forward current IFM(A) 100 Forward voltage drop versus forward current = 0.5 = 0.2 = 0.1 = 0.05 =1 90 80 70 60 50 40 Tj=150C (typical values) Tj=150C (maximum values) Tj=25C (maximum values) T 30 20 IF(AV)(A) 10 15 20 25 =tp/T 30 35 tp 40 10 0 0.00 0.25 0.50 0.75 1.00 1.25 VFM(V) 1.50 1.75 2.00 2.25 2.50 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration IRM(A) 45 40 35 VR=400V Tj=125C Peak reverse recovery current versus dI F /dt (typical values) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 25 0.5 20 0.4 0.3 0.2 Single pulse IF=2 x IF(AV) IF=IF(AV) 30 IF=0.5 x IF(AV) 15 10 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 5 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 5. trr(ns) 800 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 0 50 Reverse recovery time versus dIF/dt Figure 6. (typical values) Qrr(nC) 3500 VR=400V Tj=125C VR=400V Tj=125C Reverse recovery charges versus dIF/dt (typical values) 3000 2500 IF=2 x IF(AV) IF=2 x IF(AV) 2000 IF=IF(AV) IF=0.5 x IF(AV) IF=IF(AV) 1500 1000 500 IF=0.5 x IF(AV) dIF/dt(A/s) 0 100 150 200 250 300 350 400 450 500 0 100 dIF/dt(A/s) 200 300 400 500 3/10 Characteristics STTH30L06 Figure 7. Reverse recovery softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature S factor 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.2 IF< 2 x IF(AV) VR=400V Tj=125C 1.4 S factor 1.2 1.0 0.8 QRR 0.6 0.4 trr IRM IF=IF(AV) VR=400V Reference: Tj=125C dIF/dt(A/s) 0.0 0 50 100 150 200 250 300 350 400 450 500 Tj(C) 0.0 25 50 75 100 125 Figure 9. VFP(V) 10 9 8 7 6 5 4 3 2 1 0 0 50 IF=IF(AV) Tj=125C Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) 500 450 400 350 300 250 200 150 100 IF=IF(AV) VFR=1.1 x VF max. Tj=125C dIF/dt(A/s) 100 150 200 250 300 350 400 450 500 50 0 0 100 dIF/dt(A/s) 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C Figure 12. Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU=35m) (D2PAK) Rth(j-a)(C/W) 80 70 60 50 100 40 30 20 10 VR(V) 10 1 10 100 1000 SCU(cm) 0 0 5 10 15 20 25 30 35 40 4/10 STTH30L06 Package information 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm (TO-220FPAC) / 0.55 Nm (TO-220AC) Maximum torque value: 1.0 Nm (TO-220FPAC) / 0.70 Nm (TO-220AC) D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 Table 5. Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0 8 0.016 typ. 0 8 Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 5/10 Package information Table 6. DO247 dimensions Dimensions Ref. Millimeters Min. A V STTH30L06 Inches Min. Typ. Max. 0.203 0.102 0.031 0.055 0.078 Typ. Max. 4.85 2.20 0.40 1.00 2.00 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 5.15 0.191 2.60 0.086 0.80 0.015 1.40 0.039 D E Dia V F F2 H A F3 G 2.40 0.078 0.429 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139 0.094 L5 H L L2 L4 F2 L3 F3 V2 F G M E L1 D 0.620 0.793 0.169 L L1 L2 L3 L4 L5 M V V2 Dia. 0.582 0.118 0.143 6/10 STTH30L06 Table 7. TO-220AC dimensions Package information Dimensions Ref. Millimeters Min. A H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/10 Package information Table 8. DOP3I dimensions Dimensions Ref. E R E1 OP c A STTH30L06 Millimeters Min. Max. 4.60 1.40 1.55 0.70 13.10 15.50 7.75 11.30 21.10 15.60 4.17 2.90 Inches Min. 0.173 0.047 0.057 0.020 0.474 0.594 0.297 0.425 0.815 0.565 0.161 0.106 Max. 0.181 0.055 0.061 0.028 0.516 0.610 0.305 0.445 0.831 0.614 0.164 0.114 A b c c1 4.40 1.20 1.45 0.50 12.15 15.10 7.55 10.80 20.4 14.35 4.08 2.70 G D Y D E E1 L e G L c1 Q b e P Q R Y 4.60 typ. 15.80 16.50 0.181 typ. 0.622 0.650 8/10 STTH30L06 Ordering information 3 Ordering information Ordering type STTH30L06D STTH30L06G STTH30L06G-TR STTH30L06W STTH30L06PI Marking STTH30L06D STTH30L06G STTH30L06G STTH30L06W STTH30L06PI Package TO-220AC D PAK D2PAK DO-247 DOP3I 2 Weight 1.90 g 1.48 g 1.48 g 4.40 g 4.46 g Base qty 50 50 1000 30 30 Delivery mode Tube Tube Tape & reel Tube Tube 4 Revision history Date 07-Sep-2004 21-Oct-2004 11-Jan-06 10-Aug-2006 Revision 1 2 3 4 First issue. DOP3I package added. On page 2: - IF(RMS) corrected from 30 A to 50 A - IF(AV) corrected from 50 A to 30 A Reformatted to current standards. SOD-93 packaage removed. Changes 9/10 STTH30L06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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